Advanced LDPC

Advanced LDPC

Advanced Low-Density Parity-Check (LDPC) codes are sophisticated error-correction algorithms designed to enhance data reliability in high-performance storage and communication systems, such as SSDs and wireless networks. The core principle of LDPC involves using a matrix-based method to detect and correct errors, ensuring data integrity during transmission or storage.

Selected SSD Controller

Selected SSD Controller

SSD controller, also known as a processor, serves as the core logic that connects flash memory to the SSD’s input/output interfaces and executes firmware—often updatable—to support evolving features, while industrial SSDs not only deliver high-speed performance but also prioritize reliability, consistency, endurance, and manageability, making controller design especially critical in 24/7 industrial environments where multiple drives operate concurrently with minimal idle time and flash memory cells wear out due to sustained write workloads.

Conformal Coating

Conformal Coating

Conformal coating is a protective layer applied to printed circuit boards (PCBs) to shield them and their components from environmental damage and corrosion. Typically applied with a thickness of 30-210μm, the coating conforms closely to the shape of the PCB and its components, covering solder joints, exposed leads, traces, and other metalized areas. By enhancing resistance to moisture, pollution, dust, and chemical contaminants, conformal coating helps extend the lifespan of electronic products.

Underfill

Underfill

Underfill technology is a cutting-edge solution designed to enhance the reliability of electronic components. The process involves injecting a specialized filling material between the bottom of components on a PCBA (Printed Circuit Board Assembly) and the substrate.

Wide Temperature

Wide Temperature

We are pioneers in developing high-performance products designed to endure extreme temperatures. Leveraging our Advanced Sorting technology, we have built a customized die bank database tailored for a variety of NAND chip brands and types. Our top-tier industrial solutions, including DRAM modules, operate reliably in temperatures as low as -40°C and as high as 105°C. These robust products are vital in critical sectors such as industrial processing, logistics, and telecommunications. To ensure their durability, we subject them to rigorous 3000 Power Cycle tests.

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